The Advanced Semiconductor Academy of Malaysia (ASEM) has launched two training programmes — the National Semiconductor Excellence Programme (NSEP) and the Global Semiconductor Exchange Programme (GSEP) to equip university students, fresh graduates, and professionals with essential skills in chip design, testing, and verification to meet Malaysia’s growing demand for semiconductor talent.
ASEM general manager Angel Low said the launch of the two initiatives support Malaysia’s vision to build a world-class semiconductor workforce and enhance its position in the global supply chain. “GSEP is a unique opportunity for Malaysian engineers to gain global experience and learn from some of the best minds in the semiconductor industry. “By integrating international expertise with local training, we aim to create a new generation of skilled semiconductor engineers,” she said.
The NSEP is a 25-day intensive chip design training programme held at the Malaysia IC Design Park I, located at the Puchong Financial Corporate Centre. The programme, which targets Year Three and Year Four engineering students, fresh graduates, and professionals, features practical labs and hands-on projects in semiconductor design. It also offers industry-relevant coursework on IC design and fabrication, along with mentorship from leading semiconductor experts.
GSEP offers an eight-week immersive training programme with two specialised tracks. The IC design training, conducted in Shenzhen, China, in collaboration with the Micro-Nano Institute, equips participants with advanced IC design techniques and international industry exposure. The test and verification training, held in Puchong, is led by international experts from China’s SpeedCury and focuses on semiconductor testing, debugging, and verification processes.
Both programmes are fully sponsored, covering training fees, learning materials, and meals, and the GSEP IC design training in Shenzhen includes accommodation.
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